JTC's Open Innovation Call for Robotics, Automation and Autonomous Solutions

In this third Open Innovation Call, JTC is looking for robotics, automation and autonomous solutions to improve the way we build, operate and manage our buildings and estates.

Challenge Statements

Click on for more details on each challenge statement!



The Call is open to all industry players in the relevant field with experience in robotics and automation, including robotics/automation solutions, companies and engineering startups, industry researchers and academia

How to Apply

The relevant documents maybe downloaded here:

Submission for all proposals must be in the format of the Proposal Template attached together with all supporting/relevant documents to JTC_Open_Innovation@jtc.gov.sg, quoting the following in the email subject line: "Submission for JTC's 3rd Open Innovation Call – [Proposed Title] by [Company Name]."

The proposal submitted must clearly state how it addresses the requirements of the Challenge Statement.

Please refer to the 3rd Open Innovation Call's Factsheet and Frequently Asked Questions for more information.
For other enquiries, please email JTC_Open_Innovation@jtc.gov.sg.

Submission Deadline

Proposals for the third Open Innovation Call can be submitted to JTC_Open_Innovation@jtc.gov.sg starting 30 May 2017. The deadline for submissions is 31 July 2017, Monday, 2359, (Singapore Time, GMT+8).

Industry Briefing on 3rd Open Innovation Call

All companies/organisations are invited to attend an industry briefing on the 3rd Open Innovation Call to find out more about the 8 challenge statements.

Due to overwhelming response, we are organising another one for those who were unable to make if for the first briefing in June. Details are as follows:

Industry Briefing:
Date:          Friday, 7 July 2017
Time:          2-5pm
Location:   Level 2 – Theatrette
                     JTC Summit
                     8 Jurong Town Hall Road
                     Singapore 609434

To register for the 7th July Industry Briefing, please fill in the registration form in the link below